Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | LTB |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Dual Dual Drain |
Package Width | 4(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | SOIC |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 33 |
Typical Rise Time (ns) | 26 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 2000 |
Typical Gate Charge @ Vgs (nC) | 22(Max)@4.5V |
Maximum Gate Source Voltage (V) | ±12 |
Typical Output Capacitance (pF) | 310 |
Typical Turn-On Delay Time (ns) | 8.4 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 51 |
Typical Gate to Drain Charge (nC) | 9(Max) |
Maximum Gate Threshold Voltage (V) | 0.7(Min) |
Typical Gate to Source Charge (nC) | 3.3(Max) |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 4.3 |
Typical Input Capacitance @ Vds (pF) | 610@15V |
Typical Reverse Recovery Charge (nC) | 71 |
Maximum Drain Source Resistance (MOhm) | 90@4.5V |
Description |