Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
PCB changed | 8 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N|P |
Configuration | Dual Dual Drain |
Package Width | 3 |
Package Height | 0.86 |
Package Length | 3 |
Product Category | Power MOSFET |
Supplier Package | Micro |
Process Technology | HEXFET |
Typical Fall Time (ns) | 16@N Channel|43@P Channel |
Typical Rise Time (ns) | 24@N Channel|35@P Channel |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1250 |
Typical Gate Charge @ Vgs (nC) | 5.3@4.5V@N Channel|5.4@4.5V@P Channel |
Maximum Gate Source Voltage (V) | ±12 |
Typical Turn-On Delay Time (ns) | 5.7@N Channel|9.1@P Channel |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 15@N Channel|38@P Channel |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 2.4@N Channel|1.7@P Channel |
Typical Input Capacitance @ Vds (pF) | 260@15V@N Channel|240@15V@P Channel |
Maximum Drain Source Resistance (mOhm) | 140@4.5V@N Channel|270@4.5V@P Channel |
Description |