Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual Dual Drain |
Package Width | 4(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | SOIC |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 3.4 |
Typical Rise Time (ns) | 9.3@Q 2|8.3@Q 1 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 2000 |
Typical Gate Charge @ Vgs (nC) | 4.6@4.5V@Q 1|6.9@4.5V@Q 2 |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 5.2@Q 1|6.2@Q 2 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 6.9@Q 1|8.1@Q 2 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 7.8@Q 1|8.9@Q 2 |
Typical Input Capacitance @ Vds (pF) | 600@15V@Q 1|910@15V@Q 2 |
Maximum Drain Source Resistance (mOhm) | 21.8@10V@Q 1|17.1@10V@Q 2 |
Description |