Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
PCB changed | 8 |
Part Status | LTB |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual Dual Drain |
Package Width | 3.3 |
Package Height | 0.88 |
Package Length | 3.3 |
Product Category | Power MOSFET |
Supplier Package | PQFN EP |
Maximum IDSS (uA) | 20 |
Process Technology | HEXFET |
Standard Package Name | QFN |
Typical Fall Time (ns) | 2.6 |
Typical Rise Time (ns) | 4.7 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 2300 |
Typical Gate Charge @ 10V (nC) | 4.2 |
Typical Gate Charge @ Vgs (nC) | 4.2@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 3.4 |
Maximum Drain Source Voltage (V) | 100 |
Typical Turn-Off Delay Time (ns) | 5.2 |
Maximum Gate Threshold Voltage (V) | 4 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 2.3 |
Typical Input Capacitance @ Vds (pF) | 251@25V |
Maximum Drain Source Resistance (MOhm) | 195@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |