Product Attribute | Attribute Value |
Tab | Tab |
PPAP | No |
EU RoHS | Not Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 2 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 6.22(Max) |
Package Height | 2.39(Max) |
Package Length | 6.73(Max) |
Product Category | Power MOSFET |
Supplier Package | DPAK |
Process Technology | HEXFET |
Standard Package Name | TO-252 |
Typical Fall Time (ns) | 46 |
Typical Rise Time (ns) | 58 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 66000 |
Typical Gate Charge @ 10V (nC) | 58(Max) |
Typical Gate Charge @ Vgs (nC) | 58(Max)@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 15 |
Maximum Drain Source Voltage (V) | 100 |
Typical Turn-Off Delay Time (ns) | 45 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 13 |
Typical Input Capacitance @ Vds (pF) | 760@25V |
Maximum Drain Source Resistance (mOhm) | 205@10V |
Description |