Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
ECCN (US) | Contact Export |
Automotive | No |
Part Status | Unconfirmed |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Product Category | Power MOSFET |
Maximum IDSS (uA) | 25 |
Process Technology | HEXFET |
Typical Fall Time (ns) | 140(Max) |
Typical Rise Time (ns) | 140(Max) |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 150000 |
Typical Gate Charge @ Vgs (nC) | 180(Max)@12V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 33(Max) |
Maximum Drain Source Voltage (V) | 200 |
Typical Turn-Off Delay Time (ns) | 140(Max) |
Maximum Gate Threshold Voltage (V) | 4.5 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 26 |
Typical Input Capacitance @ Vds (pF) | 3100@25V |
Maximum Drain Source Resistance (MOhm) | 105@12V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |