Product Attribute | Attribute Value |
HTS | 8541.29.00.95 |
PPAP | No |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
PCB changed | 6 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Quad Drain |
Package Width | 1.75(Max) |
Package Height | 1.3(Max) |
Package Length | 3(Max) |
Product Category | Power MOSFET |
Supplier Package | TSOP |
Maximum IDSS (uA) | 1 |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 15 |
Typical Rise Time (ns) | 11 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 2000 |
Typical Gate Charge @ Vgs (nC) | 11@4.5V |
Maximum Gate Source Voltage (V) | ±12 |
Typical Turn-On Delay Time (ns) | 5.4 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 32 |
Maximum Gate Threshold Voltage (V) | 1.1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 8.3 |
Typical Input Capacitance @ Vds (pF) | 1010@25V |
Maximum Drain Source Resistance (MOhm) | 17.5@4.5V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |