Tab | Tab |
PPAP | No |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 4 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Dual Drain |
Package Width | 3.5 |
Package Height | 1.57 |
Package Length | 6.5 |
Product Category | Power MOSFET |
Supplier Package | SOT-223 |
Maximum IDSS (uA) | 1 |
Standard Package Name | SOT |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 24|20 |
Typical Rise Time (ns) | 45|33 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3130 |
Typical Gate Charge @ 10V (nC) | 15 |
Typical Gate Charge @ Vgs (nC) | 15@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 153 |
Typical Turn-On Delay Time (ns) | 16|10 |
Maximum Drain Source Voltage (V) | 30 |
Typical Gate Plateau Voltage (V) | 3 |
Typical Turn-Off Delay Time (ns) | 23|38 |
Maximum Diode Forward Voltage (V) | 1.5 |
Typical Diode Forward Voltage (V) | 1.1 |
Maximum Gate Threshold Voltage (V) | 3 |
Minimum Gate Threshold Voltage (V) | 1 |
Typical Gate Threshold Voltage (V) | 1.75 |
Typical Reverse Recovery Time (ns) | 34 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 5.2 |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 500@25V |
Typical Reverse Recovery Charge (nC) | 36 |
Maximum Drain Source Resistance (MOhm) | 100@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 26 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 3.13 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 58@25V |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 5.2 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 80 |
Description | |