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SI3459BDV/E3-T1
SI3459BDV/E3-T1
MOSFETs SI3459BDV/E3-T1
Vishay
SI3459BDV/E3-T1
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count6
AutomotiveNo
Lead ShapeGull-wing
PCB changed6
Part StatusActive
Channel ModeEnhancement
Channel TypeP
ConfigurationSingle Quad Drain
Package Width1.65
Package Height1(Max)
Package Length3.05
Product CategoryPower MOSFET
Supplier PackageTSOP
Maximum IDSS (uA)1
Process TechnologyTMOS
Standard Package NameSOP
Typical Fall Time (ns)10|13
Typical Rise Time (ns)12|60
Number of Elements per Chip1
Maximum Gate Resistance (Ohm)20
Minimum Gate Resistance (Ohm)2
Maximum Power Dissipation (mW)2000
Typical Gate Charge @ 10V (nC)7.7
Typical Gate Charge @ Vgs (nC)7.7@10V|4.4@4.5V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)40
Typical Turn-On Delay Time (ns)5|45
Maximum Drain Source Voltage (V)60
Typical Gate Plateau Voltage (V)3.75
Typical Turn-Off Delay Time (ns)16|18
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.8
Typical Gate to Drain Charge (nC)2.5
Maximum Gate Threshold Voltage (V)3
Minimum Gate Threshold Voltage (V)1
Typical Gate to Source Charge (nC)1.3
Typical Reverse Recovery Time (ns)28
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)2.2
Operating Junction Temperature (°C)-55 to 150
Typical Input Capacitance @ Vds (pF)350@30V
Typical Reverse Recovery Charge (nC)35
Maximum Drain Source Resistance (MOhm)216@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)8
Maximum Power Dissipation on PCB @ TC=25°C (W)2000
Typical Reverse Transfer Capacitance @ Vds (pF)30@30V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)2.2
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)110
Description
Trans MOSFET P-CH 60V 2.2A 6-Pin TSOP T/R
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