Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 8 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Hex Drain |
Package Width | 1.9 |
Package Height | 0.8(Max) |
Package Length | 3 |
Product Category | Power MOSFET |
Supplier Package | PowerPAK ChipFET |
Maximum IDSS (uA) | 1 |
Process Technology | TrenchFET |
Standard Package Name | Chip FET |
Typical Fall Time (ns) | 11 |
Typical Rise Time (ns) | 13 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3500 |
Typical Gate Charge @ 10V (nC) | 6 |
Typical Gate Charge @ Vgs (nC) | 2.8@4.5V|6@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 12 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 16 |
Maximum Gate Threshold Voltage (V) | 3 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 6 |
Typical Input Capacitance @ Vds (pF) | 325@15V |
Maximum Drain Source Resistance (MOhm) | 41@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |