Product Attribute | Attribute Value |
HTS | 8541.10.00.80 |
PPAP | No |
EU RoHS | Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P|N |
Configuration | Dual Dual Source |
Package Width | 4.4 |
Package Height | 1 |
Package Length | 3 |
Product Category | Power MOSFET |
Supplier Package | TSSOP |
Process Technology | TrenchFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 21@P Channel|20@N Channel |
Typical Rise Time (ns) | 30@P Channel|40@N Channel |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1000 |
Typical Gate Charge @ Vgs (nC) | 14.5@4.5V@P Channel|13@4.5V@N Channel |
Maximum Gate Source Voltage (V) | ±12 |
Typical Turn-On Delay Time (ns) | 27@P Channel|22@N Channel |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 57@P Channel|50@N Channel |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 3.5@P Channel|4.5@N Channel |
Maximum Drain Source Resistance (mOhm) | 50@4.5V@P Channel|30@4.5V@N Channel |
Description |