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SI7450DP-T1-GE3
SI7450DP-T1-GE3
MOSFETs SI7450DP-T1-GE3
Vishay
SI7450DP-T1-GE3
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
HTS8541.29.00.95
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count8
AutomotiveUnknown
Lead ShapeNo Lead
PCB changed8
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Quad Drain Triple Source
Package Width5.89
Package Height1.07(Max)
Package Length4.9
Product CategoryPower MOSFET
Supplier PackagePowerPAK SO EP
Maximum IDSS (uA)1
Process TechnologyTrenchFET
Typical Fall Time (ns)25
Typical Rise Time (ns)20
Number of Elements per Chip1
Maximum Gate Resistance (Ohm)1.5
Minimum Gate Resistance (Ohm)0.2
Maximum Power Dissipation (mW)5200
Typical Gate Charge @ 10V (nC)34
Typical Gate Charge @ Vgs (nC)34@10V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)75
Typical Turn-On Delay Time (ns)14
Maximum Drain Source Voltage (V)200
Typical Gate Plateau Voltage (V)4.7
Typical Turn-Off Delay Time (ns)32
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.75
Typical Gate to Drain Charge (nC)12
Maximum Gate Threshold Voltage (V)4.5
Minimum Gate Threshold Voltage (V)2
Typical Gate to Source Charge (nC)7.5
Typical Reverse Recovery Time (ns)70
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)3.2
Operating Junction Temperature (°C)-55 to 150
Maximum Drain Source Resistance (MOhm)80@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)40
Maximum Power Dissipation on PCB @ TC=25°C (W)5.2
Maximum Continuous Drain Current on PCB @ TC=25°C (A)5.3
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)65
Description
Trans MOSFET N-CH 200V 3.2A Automotive 8-Pin PowerPAK SO EP T/R
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