Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 30 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 30 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 1.96 |
Package Height | 0.21 |
Package Length | 2.36 |
Product Category | Power MOSFET |
Supplier Package | Power Micro Foot |
Maximum IDSS (uA) | 1 |
Process Technology | TrenchFET |
Standard Package Name | BGA |
Typical Fall Time (ns) | 35 |
Typical Rise Time (ns) | 40 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3100 |
Typical Gate Charge @ Vgs (nC) | 70@4.5V|120@8V |
Maximum Gate Source Voltage (V) | ±8 |
Typical Turn-On Delay Time (ns) | 35 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 115 |
Maximum Gate Threshold Voltage (V) | 1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 16.7 |
Typical Input Capacitance @ Vds (pF) | 6900@10V |
Maximum Drain Source Resistance (mOhm) | 8@4.5V |
Maximum Gate Source Leakage Current (nA) | 10000 |
Description |