HTS | 8541.29.00.95 |
Tab | Tab |
PPAP | Unknown |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | Yes |
Lead Shape | Gull-wing |
PCB changed | 2 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 6.22 |
Package Height | 2.3 |
Package Length | 6.5 |
Product Category | Power MOSFET |
Supplier Package | DPAK |
Maximum IDSS (uA) | 1 |
Process Technology | SIPMOS |
Standard Package Name | TO-252 |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 11 |
Typical Rise Time (ns) | 5.8 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 80000 |
Typical Gate Charge @ 10V (nC) | 22 |
Typical Gate Charge @ Vgs (nC) | 22@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 230 |
Typical Turn-On Delay Time (ns) | 12 |
Maximum Drain Source Voltage (V) | 60 |
Typical Gate Plateau Voltage (V) | 5.56 |
Typical Turn-Off Delay Time (ns) | 24.5 |
Maximum Diode Forward Voltage (V) | 1.33 |
Typical Diode Forward Voltage (V) | 1 |
Typical Gate to Drain Charge (nC) | 9.3 |
Maximum Gate Threshold Voltage (V) | 4 |
Minimum Gate Threshold Voltage (V) | 2.1 |
Typical Gate Threshold Voltage (V) | 3 |
Typical Gate to Source Charge (nC) | 4.4 |
Typical Reverse Recovery Time (ns) | 70 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 18.6 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 690@25V |
Typical Reverse Recovery Charge (nC) | 139 |
Maximum Drain Source Resistance (MOhm) | 130@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 74.4 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 95@25V |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 75 |
Description | |