Tab | Tab |
PPAP | No |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 3 |
Automotive | No |
Lead Shape | Through Hole |
PCB changed | 3 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 2.4(Max) |
Package Height | 6.2(Max) |
Package Length | 6.6(Max) |
Product Category | Power MOSFET |
Supplier Package | IPAK |
Maximum IDSS (uA) | 1 |
Standard Package Name | TO-251 |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 46 |
Typical Rise Time (ns) | 18 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 110000 |
Typical Gate Charge @ Vgs (nC) | 40@4.5V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 740 |
Typical Turn-On Delay Time (ns) | 17 |
Maximum Drain Source Voltage (V) | 30 |
Typical Gate Plateau Voltage (V) | 3.8 |
Typical Turn-Off Delay Time (ns) | 75 |
Maximum Diode Forward Voltage (V) | 1.1 |
Typical Gate to Drain Charge (nC) | 15.8 |
Maximum Gate Threshold Voltage (V) | 2.5 |
Minimum Gate Threshold Voltage (V) | 1 |
Typical Gate to Source Charge (nC) | 16.3 |
Typical Reverse Recovery Time (ns) | 34 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 80 |
Operating Junction Temperature (°C) | 175 |
Typical Input Capacitance @ Vds (pF) | 4040@25V |
Typical Reverse Recovery Charge (nC) | 35 |
Maximum Drain Source Resistance (mOhm) | 3.3@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 320 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 425@25V |
Description | |