PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single |
Package Width | 1.3 |
Package Height | 0.98 |
Package Length | 2.9 |
Product Category | Small Signal |
Supplier Package | SOT-23 |
Maximum IDSS (uA) | 1 |
Standard Package Name | SOT-23 |
Typical Fall Time (ns) | 3.3 |
Typical Rise Time (ns) | 2.1 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 806 |
Typical Gate Charge @ 10V (nC) | 3.5 |
Typical Gate Charge @ Vgs (nC) | 1.8@5V|3.5@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 13.1 |
Typical Turn-On Delay Time (ns) | 1.6 |
Maximum Drain Source Voltage (V) | 100 |
Typical Gate Plateau Voltage (V) | 4.2 |
Typical Turn-Off Delay Time (ns) | 5.9 |
Maximum Diode Forward Voltage (V) | 0.95 |
Typical Diode Forward Voltage (V) | 0.85 |
Typical Gate to Drain Charge (nC) | 1.6 |
Maximum Gate Threshold Voltage (V) | 4 |
Minimum Gate Threshold Voltage (V) | 2 |
Typical Gate to Source Charge (nC) | 0.6 |
Typical Reverse Recovery Time (ns) | 29 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 0.7 |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 141@50V |
Typical Reverse Recovery Charge (nC) | 31 |
Maximum Drain Source Resistance (mOhm) | 1000@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 3.1 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 0.806 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 10.8@50V |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 0.7 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 200 |
Description | |