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Memory Modules M393A2K43BB1-CTD
Samsung Electronics
M393A2K43BB1-CTD
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Memory
Memory Modules
Specification
| Product Attribute | Attribute Value |
| HTS | 8473.30.11.40 |
| PPAP | No |
| Module | DRAM Module |
| EU RoHS | Compliant |
| Mounting | Socket |
| ECCN (US) | 4A994.a |
| Pin Count | 288 |
| Automotive | No |
| Lead Shape | No Lead |
| CAS Latency | 19 |
| ECC Support | No |
| Module Type | 288RDIMM |
| PCB changed | 288 |
| Part Status | Active |
| Subcategory | DDR4 SDRAM |
| Organization | 2Gx72 |
| Package Width | 3.9(Max) |
| Module Density | 16Gbyte |
| Package Height | 31.25 |
| Package Length | 133.35 |
| Number of Ranks | Dual |
| Supplier Package | RDIMM |
| Chip Package Type | FBGA |
| Chip Configuration | 1Gx8 |
| Chip Density (bit) | 8G |
| Data Bus Width (bit) | 72 |
| Maximum Clock Rate (MHz) | 2666 |
| Number of Chip per Module | 18 |
| Supplier Temperature Grade | Commercial |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | 0 |
| Typical Operating Supply Voltage (V) | 1.2 |
| Description |
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