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M393B2873GB0-CH908
M393B2873GB0-CH908
Memory Modules M393B2873GB0-CH908
Samsung Electronics
M393B2873GB0-CH908
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
HTS8542.31.00.01
ModuleDRAM Module
MountingSocket
ECCN (US)4A994.a
Pin Count240
CAS Latency9
ECC SupportNo
Module Type240RDIMM
PCB changed240
Part StatusObsolete
SubcategoryDDR3 SDRAM
Organization128Mx72
Package Width4(Max)
Module Density1Gbyte
Package Height30
Package Length133.35
Number of RanksSingle
Supplier PackageRDIMM
Chip Package Type78FBGA
Chip Configuration128Mx8
Chip Density (bit)1G
Data Bus Width (bit)72
Operating Current (mA)1310
Maximum Clock Rate (MHz)1333
Number of Chip per Module9
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Module DDR3 SDRAM 1Gbyte 240RDIMM
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