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M470T5663QZ3-CF700
M470T5663QZ3-CF700
Memory Modules M470T5663QZ3-CF700
Samsung Electronics
M470T5663QZ3-CF700
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Memory
Memory Modules
Specification
Product AttributeAttribute Value
PLLNo
PPAPNo
ModuleDRAM Module
EU RoHSCompliant
MountingSocket
ECCN (US)4A994.a
Pin Count200
AutomotiveNo
Lead ShapeNo Lead
CAS Latency6
ECC SupportNo
Module Type200USODIMM
PCB changed200
Part StatusObsolete
SubcategoryDDR2 SDRAM
Module SidesDouble
Organization256Mx64
Self RefreshYes
Package Width3.8(Max)
Module Density2Gbyte
Package Height30
Package Length67.6
Number of RanksDual
Supplier PackageUSODIMM
Chip Package TypeFBGA
Chip Configuration128Mx8
Chip Density (bit)1G
SPD EEPROM SupportYes
Data Bus Width (bit)64
Number of Chip Banks8
Max. Access Time (ns)0.4
Operating Current (mA)1360
Maximum Clock Rate (MHz)800
Number of Chip per Module16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Module DDR2 SDRAM 2Gbyte 200USODIMM
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