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Memory Modules MTA18ASF2G72HBZ-3G2E1
Micron Technology
MTA18ASF2G72HBZ-3G2E1
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Memory
Memory Modules
Specification
| Product Attribute | Attribute Value |
| PLL | No |
| PPAP | No |
| Module | DRAM Module |
| PC Type | PC4-3200 |
| Mounting | Socket |
| Pin Count | 260 |
| Automotive | No |
| CAS Latency | 22 |
| ECC Support | Yes |
| Module Type | 260SODIMM |
| PCB changed | 260 |
| Part Status | Obsolete |
| Subcategory | DDR4 SDRAM |
| Module Sides | Double |
| Organization | 2Gx72 |
| Self Refresh | Yes |
| Package Width | 3.7(Max) |
| Module Density | 16Gbyte |
| Package Height | 30 |
| Package Length | 69.6 |
| Number of Ranks | Dual |
| Supplier Package | SODIMM |
| Chip Configuration | 1Gx8 |
| Chip Density (bit) | 8G |
| SPD EEPROM Support | Yes |
| Data Bus Width (bit) | 72 |
| Number of Chip Banks | 16 |
| Operating Current (mA) | 1935 |
| Maximum Clock Rate (MHz) | 3200 |
| Number of Chip per Module | 18 |
| Supplier Temperature Grade | Extended |
| Maximum Operating Temperature (°C) | 105 |
| Minimum Operating Temperature (°C) | -40 |
| Description |
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