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S72XS256RE0AHBJH0
S72XS256RE0AHBJH0
Multi-Chip Package Memory S72XS256RE0AHBJH0
Cypress
S72XS256RE0AHBJH0
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Memory
Multi-Chip Package Memory
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
MountingSurface Mount
ECCN (US)3A991.B.1.A
PackagingTray
Pin Count133
AutomotiveNo
Lead ShapeBall
PCB changed133
Part StatusObsolete
Organization16Mx16 Flash + 16Mx16 PSRAM
Package Width8
Package Height0.74(Max)
Package Length8
ProgrammabilityYes
Supplier PackageFBGA
Standard Package NameBGA
SRAM Memory Size (bit)256M
Flash Memory Size (bit)256M
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
MCP 16Mx16 Flash + 16Mx16 PSRAM 1.8V 133-Pin FBGA Tray
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