Product Attribute | Attribute Value |
HTS | 8542.32.00.41 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | 3A991.B.2.B |
Packaging | Tray |
Pin Count | 165 |
Automotive | No |
Lead Shape | Ball |
NVRAM Type | NVSRAM |
PCB changed | 165 |
Part Status | Active |
Organization | 1Mx16 |
Package Width | 15 |
Interface Type | Parallel |
Package Height | 0.89 |
Package Length | 17 |
Supplier Package | FBGA |
Chip Density (bit) | 16M |
Process Technology | SONOS |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 100 |
Maximum Access Time (ns) | 30 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Description |