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RF FETs BLF6G13L-250P,112
NXP
BLF6G13L-250P,112
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Diodes, Transistors and Thyristors
RF FETs
Specification
| Product Attribute | Attribute Value |
| EU RoHS | Compliant |
| Mounting | Screw |
| ECCN (US) | EAR99 |
| Packaging | Bulk |
| Pin Count | 5 |
| PCB changed | 5 |
| Part Status | NRND |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 5 |
| Configuration | Dual Common Source |
| Package Width | 9.91(Max) |
| Package Height | 4.75(Max) |
| Package Length | 34.16(Max) |
| Output Power (W) | 250(Min) |
| Supplier Package | CDFM |
| Mode of Operation | CW |
| Process Technology | LDMOS |
| Maximum Frequency (MHz) | 1300 |
| Typical Power Gain (dB) | 17 |
| Number of Elements per Chip | 2 |
| Typical Drain Efficiency (%) | 50 |
| Maximum Gate Source Voltage (V) | 13 |
| Maximum Drain Source Voltage (V) | 100 |
| Maximum Operating Temperature (°C) | 200 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Continuous Drain Current (A) | 42 |
| Typical Forward Transconductance (S) | 1 |
| Maximum Drain Source Resistance (mOhm) | 200(Typ)@6.15V |
| Description |
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