Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Loose |
Pin Count | 3 |
Automotive | No |
PCB changed | 3 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Maximum VSWR | 20(Typ) |
Configuration | Dual Common Source |
Package Width | 6.09(Max) |
Package Height | 3.94(Max) |
Package Length | 9.91(Max) |
Output Power (W) | 80(Typ) |
Supplier Package | Case M-250 |
Maximum IDSS (uA) | 1 |
Process Technology | LDMOS |
Maximum Frequency (MHz) | 1000 |
Typical Power Gain (dB) | 16 |
Number of Elements per Chip | 1 |
Typical Drain Efficiency (%) | 65 |
Maximum Power Dissipation (mW) | 130000 |
Maximum Gate Source Voltage (V) | 15 |
Maximum Drain Source Voltage (V) | 80 |
Maximum Operating Temperature (°C) | 200 |
Minimum Operating Temperature (°C) | -65 |
Maximum Continuous Drain Current (A) | 12 |
Typical Forward Transconductance (S) | 0.0025(Min) |
Typical Input Capacitance @ Vds (pF) | 78@28V |
Typical Output Capacitance @ Vds (pF) | 42@28V |
Maximum Gate Source Leakage Current (nA) | 1000 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 2.7@28V |
Description |