Product Attribute | Attribute Value |
HTS | 8542.32.00.41 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | 3A991b.2.b. |
Packaging | Tray |
Pin Count | 165 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 165 |
Part Status | Active |
Timing Type | Synchronous |
Architecture | Pipelined |
Package Width | 15 |
Package Height | 0.89 |
Package Length | 17 |
Number of Ports | 4 |
Number of Words | 1M |
Supplier Package | FBGA |
Chip Density (bit) | 36M |
Process Technology | 65nm, CMOS |
Max. Access Time (ns) | 3.2 |
Standard Package Name | BGA |
Data Rate Architecture | SDR |
Operating Current (mA) | 210 |
Address Bus Width (bit) | 3 |
Maximum Clock Rate (MHz) | 200 |
Number of Bits/Word (bit) | 36 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 2.625 |
Minimum Operating Supply Voltage (V) | 2.375 |
Typical Operating Supply Voltage (V) | 2.5 |
Description |