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DRAM Chip K4A8G165WB-BCPB000
Samsung Electronics
K4A8G165WB-BCPB000
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Memory
DRAM Chip
Specification
| Product Attribute | Attribute Value |
| HTS | 8542.32.00.36 |
| EU RoHS | Compliant |
| DRAM Type | DDR4 SDRAM |
| ECCN (US) | EAR99 |
| Part Status | Active |
| Organization | 512Mx16 |
| Interface Type | POD |
| Chip Density (bit) | 8G |
| Process Technology | CMOS |
| Data Bus Width (bit) | 16 |
| Operating Current (mA) | 166.2 |
| Address Bus Width (bit) | 18 |
| Maximum Clock Rate (MHz) | 2133 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 64M |
| Number of Bits/Word (bit) | 16 |
| Number of I/O Lines (bit) | 16 |
| Supplier Temperature Grade | Commercial |
| Maximum Operating Temperature (°C) | 95 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Typical Operating Supply Voltage (V) | 1.2 |
| Description |
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