Product Attribute | Attribute Value |
HTS | 8542.32.00.24 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR SDRAM |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 60 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 60 |
Part Status | Obsolete |
Organization | 16Mx16 |
Package Width | 8 |
Interface Type | SSTL_2 |
Package Height | 0.8 |
Package Length | 12.5 |
Supplier Package | FBGA |
Chip Density (bit) | 256M |
Process Technology | CMOS |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 175 |
Address Bus Width (bit) | 15 |
Maximum Access Time (ns) | 0.7 |
Maximum Clock Rate (MHz) | 400 |
Number of Internal Banks | 4 |
Number of Words per Bank | 4M |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 2.7 |
Minimum Operating Supply Voltage (V) | 2.5 |
Typical Operating Supply Voltage (V) | 2.6 |
Description |