Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Surface Mount |
DRAM Type | RLDRAM |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 144 |
Automotive | No |
PCB changed | 144 |
Part Status | Obsolete |
Organization | 16Mx18 |
Package Width | 11 |
Interface Type | HSTL |
Package Height | 1.2(Max) - 0.34(Min) |
Package Length | 18.5 |
Supplier Package | MBGA |
Chip Density (bit) | 288M |
Data Bus Width (bit) | 18 |
Standard Package Name | BGA |
Address Bus Width (bit) | 23 |
Maximum Clock Rate (MHz) | 300 |
Number of Internal Banks | 8 |
Number of Words per Bank | 2M |
Number of Bits/Word (bit) | 18 |
Number of I/O Lines (bit) | 18 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.9 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |