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MOSFETs BSD235NH6327XTSA1
Infineon
BSD235NH6327XTSA1
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Diodes, Transistors and Thyristors
MOSFETs
Specification
| Product Attribute | Attribute Value |
| PPAP | Unknown |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | Yes |
| Lead Shape | Gull-wing |
| PCB changed | 6 |
| Part Status | Active |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual |
| Package Width | 1.25 |
| Package Height | 0.9(Max) |
| Package Length | 2 |
| Product Category | Small Signal |
| Supplier Package | SOT-363 |
| Maximum IDSS (uA) | 1 |
| Process Technology | OptiMOS |
| Standard Package Name | SOT |
| Typical Fall Time (ns) | 1.2 |
| Typical Rise Time (ns) | 3.6 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 500 |
| Typical Gate Charge @ Vgs (nC) | 0.32@4.5V |
| Maximum Gate Source Voltage (V) | ±12 |
| Typical Output Capacitance (pF) | 23 |
| Typical Turn-On Delay Time (ns) | 3.8 |
| Maximum Drain Source Voltage (V) | 20 |
| Typical Turn-Off Delay Time (ns) | 4.5 |
| Maximum Diode Forward Voltage (V) | 1.2 |
| Maximum Gate Threshold Voltage (V) | 1.2 |
| Minimum Gate Threshold Voltage (V) | 0.7 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 0.95 |
| Operating Junction Temperature (°C) | -55 to 150 |
| Typical Input Capacitance @ Vds (pF) | 49@10V |
| Maximum Drain Source Resistance (mOhm) | 350@4.5V |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Maximum Positive Gate Source Voltage (V) | 12 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 3.8 |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 250 |
| Description |
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