Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant with Exemption |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing Lead (L-Lead) |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Quad Drain Triple Source |
Package Width | 3.3 |
Package Height | 1 |
Package Length | 3.3 |
Product Category | Power MOSFET |
Supplier Package | SON EP |
Process Technology | NexFET |
Standard Package Name | SON |
Typical Fall Time (ns) | 3.1 |
Typical Rise Time (ns) | 7.8 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 2870 |
Typical Gate Charge @ Vgs (nC) | 2.9@4.5V |
Maximum Gate Source Voltage (V) | 16 |
Typical Turn-On Delay Time (ns) | 5.3 |
Maximum Drain Source Voltage (V) | 25 |
Typical Turn-Off Delay Time (ns) | 6 |
Maximum Gate Threshold Voltage (V) | 2.3 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 14 |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 440@12.5V |
Maximum Drain Source Resistance (mOhm) | 10@10V |
Description |