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MOSFETs FDMD8260LET60
onsemi
FDMD8260LET60
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| SVHC | Yes |
| EU RoHS | Compliant with Exemption |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 12 |
| Automotive | No |
| Lead Shape | No Lead |
| PCB changed | 12 |
| Part Status | LTB |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual |
| Package Width | 3.4(Max) |
| Package Height | 0.75(Max) |
| Package Length | 5.1(Max) |
| Product Category | Power MOSFET |
| Supplier Package | PQFN EP |
| Maximum IDSS (uA) | 1 |
| Process Technology | TMOS |
| Standard Package Name | QFN |
| SVHC Exceeds Threshold | Yes |
| Typical Fall Time (ns) | 11 |
| Typical Rise Time (ns) | 10 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 2500 |
| Typical Gate Charge @ 10V (nC) | 49 |
| Typical Gate Charge @ Vgs (nC) | 49@10V|25@5V |
| Maximum Gate Source Voltage (V) | ±20 |
| Typical Turn-On Delay Time (ns) | 12 |
| Maximum Drain Source Voltage (V) | 60 |
| Typical Turn-Off Delay Time (ns) | 47 |
| Maximum Gate Threshold Voltage (V) | 3 |
| Maximum Operating Temperature (°C) | 175 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 15 |
| Typical Input Capacitance @ Vds (pF) | 3745@30V |
| Maximum Drain Source Resistance (mOhm) | 5.8@10V |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Description |
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