Tab | Tab |
PPAP | Unknown |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 9 |
Automotive | Unknown |
Lead Shape | Flat |
PCB changed | 8 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Seven Source |
Package Width | 10.38 |
Package Height | 2.3 |
Package Length | 9.9 |
Product Category | Power MOSFET |
Supplier Package | HSOF |
Maximum IDSS (uA) | 1 |
Process Technology | OptiMOS |
Standard Package Name | HSOF |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 22 |
Typical Rise Time (ns) | 18 |
Typical Switch Charge (nC) | 58 |
Number of Elements per Chip | 1 |
Maximum Gate Resistance (Ohm) | 2.7 |
Maximum Power Dissipation (mW) | 375000 |
Typical Gate Charge @ 10V (nC) | 216 |
Typical Gate Charge @ Vgs (nC) | 216@10V |
Maximum Gate Source Voltage (V) | 20 |
Typical Output Capacitance (pF) | 3400 |
Typical Turn-On Delay Time (ns) | 38 |
Maximum Drain Source Voltage (V) | 60 |
Typical Gate Plateau Voltage (V) | 4.2 |
Typical Turn-Off Delay Time (ns) | 76 |
Maximum Diode Forward Voltage (V) | 1 |
Typical Diode Forward Voltage (V) | 0.87 |
Typical Gate to Drain Charge (nC) | 39 |
Maximum Gate Threshold Voltage (V) | 3.3 |
Minimum Gate Threshold Voltage (V) | 2.1 |
Typical Gate Threshold Voltage (V) | 2.8 |
Typical Gate to Source Charge (nC) | 67 |
Typical Reverse Recovery Time (ns) | 87 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 300 |
Operating Junction Temperature (°C) | -55 to 175 |
Typical Input Capacitance @ Vds (pF) | 16000@30V |
Typical Reverse Recovery Charge (nC) | 144 |
Maximum Drain Source Resistance (MOhm) | 0.75@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 1200 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 229@30V |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 52 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 40 |
Description | |