Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
PCB changed | 6 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Dual |
Package Width | 1.75(Max) |
Package Height | 1.3(Max) |
Package Length | 3(Max) |
Product Category | Power MOSFET |
Supplier Package | TSOP |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 53 |
Typical Rise Time (ns) | 14 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 960 |
Typical Gate Charge @ Vgs (nC) | 6.4@4.5V |
Maximum Gate Source Voltage (V) | ±12 |
Typical Turn-On Delay Time (ns) | 8.2 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 62 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 2.9 |
Typical Input Capacitance @ Vds (pF) | 650@16V |
Maximum Drain Source Resistance (mOhm) | 90@4.5V |
Description |