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IRF6618TR1PBF
IRF6618TR1PBF
MOSFETs IRF6618TR1PBF
Infineon
IRF6618TR1PBF
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
HTS8541.29.00.95
PPAPNo
EU RoHSCompliant
MaterialSi
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count7
AutomotiveNo
Lead ShapeNo Lead
PCB changed7
Part StatusObsolete
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Quad Drain Dual Source
Package Width5.05(Max)
Package Height0.53(Max)
Package Length5.45(Max)
Product CategoryPower MOSFET
Supplier PackageDirect-FET MT
Maximum IDSS (uA)5
Process TechnologyDirectFET
Typical Fall Time (ns)8.1
Typical Rise Time (ns)71
Typical Switch Charge (nC)19
Number of Elements per Chip1
Maximum Gate Resistance (Ohm)2.2
Maximum Power Dissipation (mW)2800
Typical Gate Charge @ Vgs (nC)43@4.5V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)1260
Typical Turn-On Delay Time (ns)21
Maximum Drain Source Voltage (V)30
Typical Gate Plateau Voltage (V)2.9
Typical Turn-Off Delay Time (ns)27
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.78
Typical Gate to Drain Charge (nC)15
Maximum Gate Threshold Voltage (V)2.35
Minimum Gate Threshold Voltage (V)1.35
Typical Gate Threshold Voltage (V)1.64
Typical Gate to Source Charge (nC)12
Typical Reverse Recovery Time (ns)43
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-40
Maximum Continuous Drain Current (A)30
Operating Junction Temperature (°C)-40 to 150
Typical Input Capacitance @ Vds (pF)5640@15V
Typical Reverse Recovery Charge (nC)46
Maximum Drain Source Resistance (mOhm)2.2@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)240
Maximum Power Dissipation on PCB @ TC=25°C (W)2.8
Typical Reverse Transfer Capacitance @ Vds (pF)570@15V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)170
Description
Trans MOSFET N-CH Si 30V 30A 7-Pin Direct-FET MT T/R
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