Product Attribute | Attribute Value |
Tab | Tab |
PPAP | No |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 5 |
Automotive | No |
Lead Shape | Flat |
PCB changed | 4 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Quad Drain Triple Source |
Package Width | 5.9 |
Package Height | 1.05(Max) |
Package Length | 4.9 |
Product Category | Power MOSFET |
Supplier Package | SO-FL |
Maximum IDSS (uA) | 1 |
Standard Package Name | SO |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 5.1 |
Typical Rise Time (ns) | 14.9 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3700 |
Typical Gate Charge @ 10V (nC) | 33.7 |
Typical Gate Charge @ Vgs (nC) | 33.7@10V|15.7@4.5V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 10.4 |
Maximum Drain Source Voltage (V) | 60 |
Typical Gate Plateau Voltage (V) | 2.8 |
Typical Turn-Off Delay Time (ns) | 23.6 |
Maximum Diode Forward Voltage (V) | 1.2 |
Typical Diode Forward Voltage (V) | 0.88 |
Maximum Gate Threshold Voltage (V) | 2 |
Typical Reverse Recovery Time (ns) | 40.9 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 20 |
Typical Input Capacitance @ Vds (pF) | 2164@25V |
Maximum Drain Source Resistance (MOhm) | 4.7@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 3.7 |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 20 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 41 |
Description |