PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N|P |
Configuration | Dual Dual Drain |
Package Width | 4(Max) |
Package Height | 1.55(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | SOIC N |
Maximum IDSS (uA) | 1 |
Process Technology | TrenchFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 5@N Channel|20@P Channel |
Typical Rise Time (ns) | 14@N Channel|10@P Channel |
Number of Elements per Chip | 2 |
Maximum Gate Resistance (Ohm) | 2.2@N Channel|12.6@P Channel |
Minimum Gate Resistance (Ohm) | 0.5@N Channel|5@P Channel |
Maximum Power Dissipation (mW) | 2000 |
Typical Gate Charge @ 10V (nC) | 13@N Channel|15@P Channel |
Typical Gate Charge @ Vgs (nC) | 13@10V@N Channel|15@10V@P Channel |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 120@N Channel|140@P Channel |
Typical Turn-On Delay Time (ns) | 7@P Channel|6@N Channel |
Maximum Drain Source Voltage (V) | 30 |
Typical Gate Plateau Voltage (V) | 3.2@N Channel|3.9@P Channel |
Typical Turn-Off Delay Time (ns) | 30@N Channel|40@P Channel |
Maximum Diode Forward Voltage (V) | 1.2 |
Typical Diode Forward Voltage (V) | 0.8 |
Typical Gate to Drain Charge (nC) | 2 |
Maximum Gate Threshold Voltage (V) | 1 |
Minimum Gate Threshold Voltage (V) | 1 |
Typical Gate to Source Charge (nC) | 2.3@N Channel|4@P Channel |
Typical Reverse Recovery Time (ns) | 30 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 4.4@N Channel|3.7@P Channel |
Operating Junction Temperature (°C) | -55 to 150 |
Maximum Drain Source Resistance (mOhm) | 53@10V@P Channel|36@10V@N Channel |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 30 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 2 |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 5.9@N Channel|4.9@P Channel |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 110 |
Description | |