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STD110N02RT4G
STD110N02RT4G
MOSFETs STD110N02RT4G
onsemi
STD110N02RT4G
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
TabTab
PPAPYes
SVHCYes
EU RoHSCompliant with Exemption
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count3
AutomotiveYes
Lead ShapeGull-wing
PCB changed2
Part StatusObsolete
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle
Package Width6.22(Max)
Package Height2.38(Max)
Package Length6.73(Max)
Product CategoryPower MOSFET
Supplier PackageDPAK
Maximum IDSS (uA)1.5
Standard Package NameTO-252
SVHC Exceeds ThresholdYes
Typical Fall Time (ns)21
Typical Rise Time (ns)39
Number of Elements per Chip1
Maximum Power Dissipation (mW)2880
Typical Gate Charge @ Vgs (nC)23.6@4.5V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)1105
Typical Turn-On Delay Time (ns)11
Maximum Drain Source Voltage (V)24
Typical Gate Plateau Voltage (V)2.8
Typical Turn-Off Delay Time (ns)27
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.99
Typical Gate to Drain Charge (nC)11
Maximum Gate Threshold Voltage (V)2
Minimum Gate Threshold Voltage (V)1
Typical Gate Threshold Voltage (V)1.5
Typical Gate to Source Charge (nC)5.1
Typical Reverse Recovery Time (ns)36.5
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)32
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)2710@20V
Typical Reverse Recovery Charge (nC)48
Maximum Drain Source Resistance (MOhm)4.6@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)110
Maximum Power Dissipation on PCB @ TC=25°C (W)2.88
Typical Reverse Transfer Capacitance @ Vds (pF)450@20V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)17.5
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)100
Description
Trans MOSFET N-CH 24V 32A Automotive 3-Pin(2+Tab) DPAK T/R
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