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RF FETs BLF6G27LS-100,118
NXP
BLF6G27LS-100,118
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Diodes, Transistors and Thyristors
RF FETs
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 3 |
| Automotive | No |
| Lead Shape | Flat |
| PCB changed | 3 |
| Part Status | Obsolete |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 10 |
| Configuration | Single |
| Package Width | 9.91(Max) |
| Package Height | 4.72(Max) |
| Package Length | 20.7(Max) |
| Output Power (W) | 14(Typ) |
| Supplier Package | SOT-502B |
| Mode of Operation | 1-Carrier N-CDMA|1-Carrier W-CDMA |
| Process Technology | LDMOS |
| Standard Package Name | SOT |
| Maximum Frequency (MHz) | 2700 |
| Minimum Frequency (MHz) | 2500 |
| Typical Power Gain (dB) | 17 |
| Number of Elements per Chip | 1 |
| Typical Drain Efficiency (%) | 23 |
| Maximum Gate Source Voltage (V) | 13 |
| Maximum Drain Source Voltage (V) | 65 |
| Maximum Operating Temperature (°C) | 200 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Continuous Drain Current (A) | 29 |
| Typical Forward Transconductance (S) | 10.5 |
| Maximum Drain Source Resistance (mOhm) | 160@6.15V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 2.4@28V |
| Description |
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