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BSZ12DN20NS3GATMA1
BSZ12DN20NS3GATMA1
MOSFETs BSZ12DN20NS3GATMA1
Infineon
BSZ12DN20NS3GATMA1
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
PPAPNo
SVHCYes
EU RoHSCompliant with Exemption
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count8
AutomotiveNo
Lead ShapeNo Lead
PCB changed8
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Quad Drain Triple Source
Package Width3.3
Package Height1
Package Length3.3
Product CategoryPower MOSFET
Supplier PackageTSDSON EP
Maximum IDSS (uA)1
Process TechnologyOptiMOS
Standard Package NameSON
SVHC Exceeds ThresholdYes
Typical Fall Time (ns)3
Typical Rise Time (ns)4
Supplier Temperature GradeAutomotive
Typical Switch Charge (nC)1.8
Number of Elements per Chip1
Maximum Power Dissipation (mW)50000
Typical Gate Charge @ 10V (nC)6.5
Typical Gate Charge @ Vgs (nC)6.5@10V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)39
Typical Turn-On Delay Time (ns)6
Maximum Drain Source Voltage (V)200
Typical Gate Plateau Voltage (V)4.5
Typical Turn-Off Delay Time (ns)10
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)1
Typical Gate to Drain Charge (nC)1.1
Maximum Gate Threshold Voltage (V)4
Minimum Gate Threshold Voltage (V)2
Typical Gate Threshold Voltage (V)3
Typical Gate to Source Charge (nC)2.3
Typical Reverse Recovery Time (ns)74
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)11.3
Operating Junction Temperature (°C)-55 to 150
Typical Input Capacitance @ Vds (pF)510@100V
Typical Reverse Recovery Charge (nC)212
Maximum Drain Source Resistance (mOhm)125@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)45
Typical Reverse Transfer Capacitance @ Vds (pF)5.1@100V
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)60
Description
Trans MOSFET N-CH 200V 11.3A 8-Pin TSDSON EP T/R
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