Product Attribute | Attribute Value |
Material | Si |
Mounting | Screw |
ECCN (US) | EAR99 |
Packaging | Blister |
Pin Count | 4 |
PCB changed | 4 |
Channel Mode | Enhancement |
Channel Type | N |
Maximum VSWR | 50 |
Configuration | Single Dual Source |
Package Width | 12.86(Max) |
Package Height | 7.27(Max) |
Package Length | 24.9(Max) |
Output Power (W) | 150 |
Supplier Package | CRFM |
Mode of Operation | CW Class-B|SSB Class-AB |
Maximum Frequency (MHz) | 108 |
Minimum Frequency (MHz) | 28 |
Typical Power Gain (dB) | 35 |
Number of Elements per Chip | 1 |
Typical Drain Efficiency (%) | 70 |
Maximum Power Dissipation (mW) | 220000 |
Maximum Gate Source Voltage (V) | ±20 |
Maximum Drain Source Voltage (V) | 125 |
Maximum Operating Temperature (°C) | 200 |
Minimum Operating Temperature (°C) | -65 |
Maximum Continuous Drain Current (A) | 16 |
Typical Forward Transconductance (S) | 6.2 |
Typical Input Capacitance @ Vds (pF) | 480@50V |
Typical Output Capacitance @ Vds (pF) | 190@50V |
Maximum Drain Source Resistance (mOhm) | 300@10V |
Typical Reverse Transfer Capacitance @ Vds (pF) | 14@50V |
Description |