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RF FETs MRFE6VP61K25HSR5
NXP
MRFE6VP61K25HSR5
--
Diodes, Transistors and Thyristors
RF FETs
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 4 |
| Automotive | No |
| PCB changed | 4 |
| Part Status | Active |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 65 |
| Configuration | Dual Common Source |
| Package Width | 10.29(Max) |
| Package Height | 5.08(Max) |
| Package Length | 32.38(Max) |
| Output Power (W) | 1300(Typ) |
| Supplier Package | Case 375E-04 |
| Mode of Operation | Pulsed RF|CW |
| Process Technology | LDMOS |
| Maximum Frequency (MHz) | 600 |
| Minimum Frequency (MHz) | 1.8 |
| Typical Power Gain (dB) | 24 |
| Number of Elements per Chip | 2 |
| Typical Drain Efficiency (%) | 74 |
| Maximum Gate Source Voltage (V) | 10 |
| Maximum Drain Source Voltage (V) | 133 |
| Maximum Operating Temperature (°C) | 225 |
| Minimum Operating Temperature (°C) | -65 |
| Typical Input Capacitance @ Vds (pF) | 562@50V |
| Typical Output Capacitance @ Vds (pF) | 185@50V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 2.8@50V |
| Description |
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